Description
CPU Specifications
- # of Cores 2
- # of Threads 4
- Processor Base Frequency 3.60 GHz
- Cache 3 MB Intel® Smart Cache
- Bus Speed 5 GT/s
- TDP 54 W
Memory Specifications
- Max Memory Size (dependent on memory type) 32 GB
- Memory Types DDR3-1333/1600, DDR3L-1333/1600 @ 1.5V
- Max # of Memory Channels 2
- Max Memory Bandwidth 25.6 GB/s
- ECC Memory Supported ‡ Yes
Processor Graphics
- Processor Graphics ‡ Intel® HD Graphics 4400
- Graphics Base Frequency 350 MHz
- Graphics Max Dynamic Frequency 1.15 GHz
- Graphics Video Max Memory 2 GB
- Graphics Output eDP/DP/HDMI/DVI/VGA
- Max Resolution (HDMI)‡ 4096×[email protected]
- Max Resolution (DP)‡ 3840×[email protected]
- Max Resolution (eDP – Integrated Flat Panel)‡ 3840×[email protected]
- Max Resolution (VGA)‡ 1920×[email protected]
- DirectX* Support 11.1/12
- OpenGL* Support 4.3
- Intel® Quick Sync Video Yes
- Intel® InTru™ 3D Technology Yes
- Intel® Clear Video HD Technology Yes
- # of Displays Supported ‡ 3
- Device ID 0x41E
Expansion Options
- Scalability 1S Only
- PCI Express Revision Up to 3.0
- PCI Express Configurations ‡ Up to 1×16, 2×8, 1×8+2×4
- Max # of PCI Express Lanes 16
Package Specifications
- Sockets Supported FCLGA1150
- Max CPU Configuration 1
- Thermal Solution Specification PCG 2013C
- TCASE 72°C
- Package Size 37.5mm x 37.5mm
Advanced Technologies
- Intel® Turbo Boost Technology ‡ No
- Intel vPro® Platform Eligibility ‡ No
- Intel® Hyper-Threading Technology ‡ Yes
- Intel® Virtualization Technology (VT-x) ‡ Yes
- Intel® Virtualization Technology for Directed I/O (VT-d) ‡ No
- Intel® VT-x with Extended Page Tables (EPT) ‡ Yes
- Intel® Transactional Synchronization Extensions No
- Intel® 64 ‡ Yes
- Instruction Set 64-bit
- Instruction Set Extensions Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2
- Idle States Yes
- Enhanced Intel SpeedStep® Technology Yes
- Thermal Monitoring Technologies Yes
- Intel® Stable Image Platform Program (SIPP) No
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